Electronic Materials Information
Techcet Group, LLC. specializes in Market Research and Technical Trend analysis for semiconductor & electronic process materials. Our expertise covers electronic materials such as CMP slurry and Pads, Dielectric Precursors (Low K and High K), Bulk and Specialty Gases, Photoresist, Photoresist Ancillaries, Masks and Reticles, Wet Chemicals, Sputtering Targets, Silicon Carbide, Graphite, Quartz (rods, tubes, crucibles, fabricated parts), and Ceramics. We also feature market and technology reports on ALD Precursors, Advanced Dielectrics, and Advanced Metallization.
Techcet is well known for their Critical Material Reports™ written yearly, commissioned by Sematech. These comprehensive materials market and supply chain reports are available to the public. For more information on the Critical Material Reports click here.
What interconnect materials will be needed for 32nm and beyond?
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What about Cluster Boron?
See Techcet's new reports on Advanced interconnect Materials
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Ion Implant Sources!
and our All New report on
CMP Consumables
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M&A, investment, product marketing, Rose Associates, Linx, photoresist, Strippers, CMP, chemical mechanical polishing, planarization, specialty chemicals, Gases, Advanced Dielectric and Metallization Precursors, High K / ALD Precursors, Wet Chemicals,post CMP cleaning, surface cleaning, Sputtering Targets, Quartz, Ceramics, Silicon Carbide, SiC, Graphite, Masks/Reticles, TFT, LED, Solar, PV, photovoltaic, Corbett, Thirsk, SEMI, process flow, post-CMP, ITRS, ARCs, developers, wet strips, immersion, dry strips, etch gases, implant, CVD, PVD, ECD, RIE, PMD, ILD, STI, Ti, TiN, Al, Ta, TaN, Cu, W, Hf, SiC, SiCN, silane, FSG, SOG, SOD, SiCOH, SiCO, ULK, silica, SiO2, abrasives, 3MS, 4MS, Methylsilane, DMDMOS, OMCTS, DEMS, Diethylmethoxysilane, OSG, CDO, CoWP, CuSiN, Ru, low ?, NH3, Alpha Terpinene, ATRP,Chemical, mechanical, planarization, polishing, post CFind Out MP, process flow, specialty chemicals, ITRS, ARCs,developers, wet strips, immersion, dry strips, etch gases, implant, CVD, PVD, ECD, RIE, PMD, ILD, STI, Ti, TiN, Al, Ta, TaN, Cu, W, Hf, SiC, SiCN, SiO2, FSG, SOG, SiCOH, SiCO, ULK, silica, abrasives, 3MS, 4MS, methylsilane, DMDMOS, OMCTS, DEMS, diethylmethoxysilane, OSG, CDO, CoWP, CuSiN, Ru, low K, NH3, alpha terpinene, ATRP, TEMAZ, TDEAT, TDEAH
WW IC Process Materials Market
Front End Materials 2007- $12.4B
- 12.8% Overall IC Materials Growth expected for 2007
- 13% growth for Test & Packaging (TAP)
- 10% growth for All IC Manufacturing Process Materials (Direct + Indirect Materials)
- Revenue Distribution more heavily weighted toward silicon given increases in silicon ASPs
Material Spending
per Node
Resists/Ancillaries and Interconnect Materials
