Electronic Materials Information

| Publication Date | Featured Section | Related Markets | Supplier/Supply Chain Issues | Market Place |
| Quarter 1 - April 11 | Front-End Advanced Dielectrics Applications and Precursors | TEOS | Precursor Suppliers | Wafer Starts |
| - Capacitors | SiH4 | He | Materials Cost per wafer | |
| - Gate | News | Cell Phone / PDA market | ||
| - Development Trends and Issues | ||||
| Publication Date | Featured Section | Related Markets | Supplier/Supply Chain Issues | Market Place |
| Quarter 2 - August 30 | Back-End Advanced Dielectrics Applications and Precursors | ECMP | Precursor Suppliers - who, what | Wafer Starts |
| - ALD Barrier | TEOS | Raw Materials Issues | Materials Costs | |
| - Interconnect - Low K | News | PCs and PDAs | ||
| - Market Projections | ||||
| - Development Trends and Issues | ||||
| Publication Date | Featured Section | Related Markets | Supplier/Supply Chain Issues | Market Place |
| Quarter 3 - Oct 30 | Gases | NF3 | NF3 Volume Statistics | Wafer Starts |
| - AsH3, PH3, BF3, B18, etc. | NH3 | SiH4 Volume Statistics | Materials Cost per wafer | |
| - Development Trends and Issues | SiH4 | End-Use Applications | ||
| - Market Projections | ||||
| Publication Date | Featured Section | Related Markets | Supplier/Supply Chain Issues | Market Place |
| Quarter 4 - Jan 28 | Advanced Metallization Applications and Precursors | Targets: | Target Supplier Attrition | Wafer Starts |
| - Interconnect - ECD, CVD & ALD | - Ta | News | Materials Cost Issues | |
| - Development Trends and Issues | - Cu | Flash Market | ||
| - Market Projections | ||||
| - Cleaning Issues/Chemistry |