Materials Stretch to Enable 32 nm
Future Fab Article by K. Holland, Ph.D., S. Holland, Ph.D., L. Shon-Roy, J. Housley
As devices move toward the 32nm technology node, materials will become even more important to enable proper device function and performance. Higher-price materials and processes are being considered more today than ever before because scaling down the size of the device cannot be done with the traditional process materials. The leading-edge microprocessor and memory manufacturers that are producing devices with minimum features of 65nm in 2007, will be using 45nm features by 2009 in mainstream manufacturing and adopting the 32nm node three years later. While equipment for chip manufacturing often claims the limelight, current and new materials will continue to enable the integrated circuit (IC) device roadmap to higher-density chips.
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SEMI Strategic Materials Conference 1/2007 Presentation
Front End Materials - Enabling the Future of Integrated Circuits. Presented by K. Holland, Ph.D.
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SEMI Strategic Materials Conference 1/2006 Presentation
Critical Materials - Enabling the Future of Integrated Circuits. Presented by K. Holland, Ph.D.
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SEMI Strategic Materials Conference 1/2005 Presentation
Interconnect, Deposition, CMP and Cleaning Materials for IC Wafer Fabrication. Presented by K. Holland, Ph.D.
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From Old School to Essential
Chemical Mechanical Planarisation (CMP) is older than the semiconductor industry and was retired to an obscure history in the early development of semiconductors. Instead the technology has become the second most expensive part of the manufacturing process and a key enabler for the future of the industry. David Ridsdale takes a look at the past, present and future of the technology.
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Techcet Group Releases Reports on Critical Semiconductor Materials
Austin, TX (12 March 2004) -- Techcet Group, LLC has released its 2003/2004 Critical Materials Reports highlighting resource and supply issues for raw materials vital to the semiconductor industry. The reports were commissioned by International SEMATECH and subsequently have been made available to other customers.
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Material Suppliers Feel the Pinch
Each year, Techcet Group LLC (Genoa, Nev.) updates its critical materials report, which is designed to flag supply chain issues likely to affect the production of semiconductor devices. Commissioned by International SEMATECH (Austin, Texas) and available for the first time to the wider industry, these studies look for weaknesses in the supply chain and are used to evaluate the risk factors that threaten the health of the materials market. "Some of the more vulnerable suppliers are unable to maintain the levels of R&D spending needed to compete at advanced technology nodes, even at 90 nm," said Lita Shon-Roy, one of the partners at Techcet. Though there have been many acquisitions in recent years among various suppliers, Shon-Roy says it is likely that even fewer companies will play in the 65 nm device manufacturing arena.
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